Save the Date: Onto Innovation to Host Analyst Event and Participate in Upcoming Investor Conferences

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced that it will host a Company-sponsored Analyst Event on Thursday, December 17, 2026, at the New York Stock Exchange in New York City. The event will feature presentations from Onto’s executive leadership team, including Mike Plisinski, chief executive officer; Brian Roberts, chief financial officer, Ramil Yaldaei, chief operating officer, Mike Rosa, chief marketing officer, and Ido Dolev, executive vice president, product solutions group. Additional event details and registration information will be provided at a later date.

Onto Innovation’s senior management team will also participate in the following upcoming investor events:

Oppenheimer 29th Annual Virtual Technology, Internet & Communications Conference on August 12.

Needham 7th Annual Virtual Semiconductor & SemiCap 1×1 Conference on August 19.

Jefferies 2026 Semiconductor, IT Hardware & Communications Technology Conference at the Four Seasons Chicago in Chicago, Illinois, on August 24-25.

Deutsche Bank 2026 Technology Conference at the Waldorf Astoria Monarch Beach in Dana Point, California, on August 27.

Citi 2026 Global TMT Conference at the New York Hilton Midtown in New York, New York, on September 9. Michael Plisinski, chief executive officer, will participate in a fireside chat at 3:55 p.m. ET. Investors are invited to join the live fireside chat, which can be accessed on the Company’s website at investors.ontoinnovation.com. There will be a replay of the webcast available for one year on the Company’s website at www.ontoinnovation.com.

Management will be available for one-on-one meetings at these conferences. To schedule a meeting, please contact your bank salesperson.

About Onto Innovation Inc.

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging.

Our breadth of offerings across the entire semiconductor value chain combined with our connected thinking approach results in a unique perspective to help solve our customers’ most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient.

With headquarters and manufacturing in the U.S., Onto Innovation supports customers with a worldwide sales and service organization. Additional information can be found at www.ontoinnovation.com.

Source: Onto Innovation Inc.

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